Highness Microelectronics IPO
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Highness Microelectronics IPO details
Schedule of Highness Microelectronics
| Issue open date | 24 Mar 2026 |
| Issue close date | 27 Mar 2026 |
| UPI mandate deadline | 27 Mar 2026 (5 PM) |
| Allotment finalization | 30 Mar 2026 |
| Refund initiation | 01 Apr 2026 |
| Share credit | 01 Apr 2026 |
| Listing date | 02 Apr 2026 |
| Mandate end date | 12 Apr 2026 |
| Lock-in end date for anchor investors (50%) | 29 Apr 2026 |
| Lock-in end date for anchor investors (remaining) | 28 Jun 2026 |
Note: The schedule is tentative. The anchor lock-in period ends 30 days after the actual allotment date for 50% of the shares and 90 days after for the remaining portion. The allotment status can be checked on the registrar's website and the exchange website.
About Highness Microelectronics
Highness Microelectronics Limited is engaged in the design, development, integration, assembly and manufacturing of digital imaging solutions. The company operates across two main segments: “Off-the-Shelf Products” and “Market-Specific Solutions/Projects.” Its product portfolio includes flat panel displays such as TFT and LCD modules, display controllers, touch screens, electroluminescent and vacuum fluorescent displays, cable assemblies, and display enhancement solutions. Under its solutions segment, the company provides customized display systems like open-frame, panel-mount, industrial-grade and medical-grade monitors. These solutions cater to industries such as industrial automation, healthcare, railways, automobiles, and defence and aerospace. The company generates revenue through the sale of these products and project-based solutions, focusing on both standard offerings and customized applications across multiple industry verticals.
Financials of Highness Microelectronics
Issue size
| Funds Raised in the IPO | Amount |
| Total issue size | 21.67 |
| Fresh Issue – Proceeds go to the company | 19.84 |
| Offer for sale – Proceeds go to the existing investors |
1.83 |
Utilisation of proceeds
| Purpose | INR crores (%) |
| Capital expenditure (assembly line setup, Rabale facility) | 5.27 (26.57%) |
| Working capital requirements | 6.71 (33.83%) |
| Repayment/prepayment of borrowings | 1.89 (9.52%) |
| General corporate purposes | 5.97 (30.08%) |
Strengths
- Diverse product portfolio across display components and digital imaging solutions.
- Presence in multiple industries, including healthcare, railways, defence, and automation.
- Capability to offer both standard products and customised project-based solutions.
- In-house design, development, and manufacturing capabilities.
- Certifications such as ISO 9001 and ISO 13485 support quality standards.
Risks
- Heavy dependence on imported raw materials, especially from China.
- Reliance on a limited number of key suppliers for procurement.
- Significant revenue contribution from a few major customers.
- Exposure to fluctuations in raw material prices and supply chain disruptions.
- Vulnerability to regulatory changes and geopolitical risks affecting imports.